第十八届IEEE国际固态和集成电路技术会议 (ICSICT 2026)

会议组委会：

Life Honorary Chair：

Yangyuan Wang, Peking University, China

Advisory Committee Co-Chairs：

Ting-Ao Tang, Fudan University, China

Cor Claeys, Proximus, Belgium

Mengqi Zhou, IEEE China Council, China

General Chairs：

Jan Van der Spiegel, University of Pennsylvania, USA

Bin Zhao, IEEE EDS, USA

Francois Rivet, University of Bordeaux, France

Amara Amara, International Innovation Institute, Beihang University, Hangzhou Campus, China

General Co-Chairs：

Ning Xu, Wuhan University of Technology, China

Cheng Zhuo, Zhejiang University, China

Yuehang Xu, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Gaofeng Wang, Hangzhou Dianzi University, China

Technical Program Committee Chairs：

Haruo Kobayashi, Gunma University, Japan

Ming Li, Peking University, China

Bo Zhang, University of Electronic Science and Technology of China, China

Yi Zhao, Huada Semiconductor

Technical Program Committee Co-Chairs：

Bei Yu, The Chinese University of Hong Kong, China

Zheng Wang, University of Electronic Science and Technology of China, China

Wentong Zhang, University of Electronic Science and Technology of China, China

Fakhrul Zaman Rokhani, Universiti Putra Malaysia, Malaysia

Ling Zhang, Zhejiang University, China

Chaoyu Yang, Peking University, China

Jing Jin, Shanghai Jiao Tong University, China

Wentong Zhang, University of Electronic Science and Technology of China, China

Haifeng Ling, Nanjing University of Posts and Telecommunications, China

Local Arrangement Chair：

Letian Huang, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Subcommittee Chairs：

Haifeng Ling, Nanjing University of Posts and Telecommunications, China

Wentong Zhang, University of Electronic Science and Technology of China, China

Jing Jin, Shanghai Jiao Tong University, China

Chaoyu Yang, Peking University, China

Subcommittee Co-Chairs：

Hailong Jiao, Peking University, China

Zheng Wang, University of Electronic Science and Technology of China, China

Jin Wei, Peking University, China

Zhihao Yu, Nanjing University of Posts and Telecommunications, China

Special Session Chair：

Haimeng Huang, University of Electronic Science and Technology of China, China

Tutorial Chair：

Wei Mao, Xidian University, China

Industry Liaison Chairs：

Sylvain Eimer, Truth Equipment, China

Preet Yadav, NXP Semiconductors, India

Publicity Co-Chairs：

Caoyu Li, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Chaoyue Zheng, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Publication Committee Chair：

Mengqi Zhou, IEEE China Council, China

Publication Committee Co-chairs：

Lobna A. Said, Nile University, Egypt

Guoqing Deng, Sichuan Institute of Electronics, China

Treasurer：

Jianhong Zhou, Xihua University, China

Secretary General：

Tiantian Han, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

会议技术委员会：

Theme 1: Digital & System Level IC

Chair: Yuchao Yang, Peking University, China

Co-Chair: Hailong Jiao, Peking University, China

Track 1: Digital Architectures & Systems

Chair:

Zhiyi Yu, Sun Yat-sen University, China

Co-Chairs:

Yaoyu Tao, Peking University, China

Hongyang Jia, Tsinghua University, China

Track 2: Digital Circuits

Chair:

Yongpan Liu, Tsinghua University, China

Co-Chairs:

Yanan Sun, Shanghai Jiao Tong University, China

Fengbin Tu, Hong Kong University of Science and Technology, China

Track 3: Design Methodology & EDA

Chair:

Jun Yang, Southeast University, China

Co-Chairs:

Yibo Lin, Peking University, China

Yu Li, Zhejiang University, China

Theme 2: Analog

Chair: Jing Jin, Shanghai Jiao Tong University, China

Co-Chair: Zheng Wang, University of Electronic Science and Technology of China, China

Track 4: RF & Wireless

Chair:

Keping Wang, Tianjin University, China

Co-Chairs:

Jian Pang, Shanghai Jiao Tong University, China

Kai Tang, Hunan University, China

Track 5: Wireline

Chair:

Xiaoyan Gui, Xi'an Jiaotong University, China

Co-Chairs:

Bingyi Ye, East China Normal University, China

Yuekang Guo, Shanghai Jiao Tong University, China

Track 6: General Analog

Chair:

Lin Cheng, University of Science and Technology of China, China

Co-Chairs:

Junmin Jiang, Southern University of Science and Technology, China

Ang Hu, Huazhong University of Science and Technology, China

Theme 3: Devices

Chair: Wentong Zhang, University of Electronic Science and Technology of China, China

Co-Chair: Jin Wei, Peking University, China

Track 7: CMOS Logic Devices & Sensors

Chair:

Heng Wu, Peking University, China

Co-Chairs:

Wang Kang, Beihang University, China

Xiaosheng Zhang, University of Electronic Science and Technology of China, China

Track 8: Power Devices & Power IC

Chair:

Long Zhang, Southeast University, China

Co-Chairs:

Jiafei Yao, Nanjing University of Posts and Telecommunications, China

Zekun Zhou, University of Electronic Science and Technology of China, China

Track 9: Device Reliability & Security

Chair:

Mengyuan Hua, Southern University of Science and Technology, China

Co-Chairs:

Junmin Jiang, Southern University of Science and Technology, China

Zhao Qi, University of Electronic Science and Technology of China, China

Theme 4: Process & Technologies

Chair: Haifeng Ling, Nanjing University of Posts and Telecommunications, China

Co-Chair: Zhihao Yu, Nanjing University of Posts and Telecommunications, China

Track 10: Semiconductor Process Technologies

Chair:

Bobo Tian, East China Normal University, China

Co-Chairs:

Min Liao, Xidian University, China

Li Zhu, Nanjing University of Posts and Telecommunications, China

Track 11: Optoelectronics and Silicon Photonics Integration

Chair:

Linfeng Sun, Beijing Institute of Technology, China

Co-Chairs:

Ming Xu, Huazhong University of Science and Technology, China

Yuanfang Yu, Nanjing University of Posts and Telecommunications, China

Track 12: Packaging Technologies

Chair:

Jun Zhang, Nanjing University of Posts and Telecommunications, China

Co-Chairs:

Shenyang Mo, NARI Semiconductor R&D Center, China

Pengfei Zhao, Nanjing University of Posts and Telecommunications, China

征稿主题：

ICSICT 2026征文范围如下（包括但不限于以下领域）

Theme 1: Digital & System Level IC

Track 1：Digital Architectures & Systems

FPGA Circuits Design & Application

Processors, Accelerators & SoCs

Memory System & Process in Memory

System Level Testability & Reliability

Track 2：Digital Circuits

Digital Blocks

Logical/Physical-Level Security

Non-volatile Memory & Volatile Memory

Circuit Level Reliability Design

Track 3：Design Methodology & EDA

Design for Testability, Reliability & Manufacturability

Modeling，Simulation & Emulation

Design & Technology Co-Optimization

Artificial Intelligence Algorithms for EDA

Theme 2: Analog

Track 4：RF & Wireless

Building Blocks at RF, mm-wave and THz

Rx, Tx or TRx for Wireless Systems

Wireless Sensor, Radar, Imager

Device/Packaging/Modeling at RF, mm-wave and THz

Track 5：Wireline

Electrical/Optical Transmitters/Receivers for Wireline

Clock Generation and Distribution Circuits

Building Blocks for High-Speed Wireline Communications

Track 6：General Analog

Advanced Analog Circuits

High-Speed, High-Precision Data Converters

Imagers, Medical Devices & Display Systems

Efficient Power Management Circuits

Theme 3: Devices

Track 7：CMOS Logic Devices & Sensors

Advanced CMOS Logic Devices

2D & Thin Film Devices & Technologies

Flash & Non-Volatile & 3D Memory Technologies

Sensor, Sensing Microsystem, MEMS, and Bioelectronics

Smart/Intelligent Sensors & Actuators

Device Modeling & Simulation

Track 8：Power Devices & Power IC

Silicon-based Power Devices

Wide Bandgap Power Devices

Power Integrated Circuits、modules & Systems

Power Integrating & Packaging Technology

Power Device Reliability

Power Device Modeling & Simulation

Track 9：Device Reliability & Security

Back-End of Line Reliability & ESD

Aging & Remaining Useful Lifetime Prediction

PUF & Hardware Security

Devices Radiation Reliability

Theme 4: Process & Technologies

Track 10：Semiconductor Process Technologies

Compound Semiconductor Materials & Technologies

Advanced Memory Materials & Technologies

Advanced Process Technologies

Advanced Interconnect Technologies

Process Modeling & Simulation

Track 11：Optoelectronics and Silicon Photonics Integration

High-Speed Optoelectronic Devices

Silicon Photonics & Integration

Photonic Sensors & Image Sensors

Optical Computing Devices

Display Process & Integration

Track 12：Packaging Technologies

2.5D & 3D Integration

Heterogeneous Integration Packaging

Advanced Wire Bonding Technology

Modeling and Simulation for Advanced Packaging

Testing and Reliability in Advanced Packaging

投稿方式：

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1.投稿链接： http://www.icsict.org

2.下载论文模板：https://www.icsict.org/ICSICT_Paper_Template.docx

联系方式：

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会议邮箱：icsict2026@csj.uestc.edu.cn | ieeeicsict@outlook.com