2025年IEEE集成电路技术与应用国际会议（ICTA 2025）

# 工程技术# 自动化科学# 机械工程# 工程

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会议邮箱[email protected]

截稿日期2025.07.28

会议日期2025.10.22 - 10.24

官网地址

https://www.ieee-icta.org/

会议地点中国澳门

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HIGHLIGHTS

重要信息

NO.2

出版信息: 以 IEEE Xplore PDF 格式提交 2 页的英文论文特邀论文可长达 6 页组委会信息: Honorary Chair: Rui Martins General Co-Chairs: Pui-In Mak, Sai-Weng Sin TPC Co-Chairs: Bo Zhao, Yan Lu Steering Committee Chair: Lin Cheng Publication Chair: Haijun Shao

CALL FOR PAPERS

征稿主题

NO.3

RF Circuits and Wireless Systems：

Si-based RFIC building-block circuit
compound-semiconductor-based MMIC building-block circuit
LNA
PA
VCO
PLL
phase shifter
mixer
RF switch
balun
driver amplifier
transceiver
etc.

Analog and Mixed-Signal ICs：

analog circuits including amplifiers
comparators
oscillators
filters
references
nonlinear analog circuits and digitally-assisted analog circuits
data converters including Nyquist-rate and oversampling ADC and DAC
etc.

Power-management ICs：

Power management and control circuits
switched-mode power converter ICs using inductive
capacitive
and hybrid techniques
linear regulators
gate drivers
topologies for wide-bandgap devices
power and signal isolators
LED drivers
wireless power
and envelope supply modulators
energy harvesting circuits and systems.

Digital ICs and Memory：

SoC
processor
FPGA
AI and deep-learning processor
DSP
NoC
memory
etc.

Wireline ICs：

high-speed data link
optical transceiver
OEIC
SerDes
TIA
CDRs
equalizer
modulator
etc.

Modeling：

EDA and Testing
compact models and extraction techniques (silicon based)
SPICE models and extraction techniques (non-silicon)
modeling technique of GaN
SiC
ASM-HEMT
2D-material-based devices
quantum devices
test structures design and model parameter extraction
RF calibration and reliable data acquisition
EDA
EM/TCAD simulation
co-simulation and verification technique
PDK validation
etc.

Device and Process Technologies：

CMOS
FinFET
FD-SOI
BCD
SiGe
III-V
HEMT
HBT
3rd generation materials
GaN
power electronics
SiC
GaO
junctionless device
negative capacitance device
MEMS
device characterization
device FAR
3D integration
Chiplet
flash
OPT
MPT
SRAM
DRAM
3D NAND
MRAM
RRAM
PCRAM
FeRAM
crossbar
DRAM+MCU
etc.

Packaging and Hybrid Integration：

Chiplet
active antenna
EM field
filters
Hybrid MIC
MCM
SiP
SoP
TSV
flip chip assembly
wire bonding
anisotropic conductive film
interconnection technologies
multi-physics and multiscale EM computation/simulation
3D integration
etc.

Sensors and Applications：

MEMS sensors
image sensors
physical sensors
chemical sensors
bio-sensors
smart and intelligent sensors
sensor interface
sensor technology and applications
etc

System and Applications：

IC based module and system integration
automotive electronics
automotive radar
5G systems
AI systems
IoTs
healthcare and biomedical systems
etc.

Emerging Technologies and Applications：

heterogeneous integration
III-V compounds
silicon photonics
optoelectronic device
2D materials
green and implantable materials
neuromorphic device
device characterization
etc.

Intelligent Robots：

robot kinematics/dynamics/control
system integration
AI in robotics
sensor/actuator
bio-inspired systems
robot perception
human robot interaction
and robot vision
etc.

CONFERENCE SUBMISSION

会议投稿

NO.6

以 IEEE Xplore PDF 格式提交 2 页的英文论文（包括初次投稿和最终版本）。投稿链接：https://epapers2.org/icta2025