会议日期
2024.04.22 - 2024.04.24
地点
美国 亚利桑那州,坦佩
投稿截止
2024.03.05
邮箱
电话
2024年IEEE第42届VLSI测试研讨会(VTS 2024)
2024年4月22-24日
美国,亚利桑那州,坦佩
https://tttc-vts.org/public_html/new/2024/
该会议包括主题演讲、科学论文演示、简短的工业应用论文演示、特别会议和创新实践会议。
General Chairs:
Sule Ozev
Arizona State University
Email: [email protected]
Mehdi Tahoori
Karlsruhe Institute of Technology
Email: [email protected]
Program Chairs:
Naghmeh Karimi
University of Maryland, Baltimore County
Email: [email protected]
Jennifer Dworak
Southern Methodist University
Email: [email protected]
征稿主题:
Analog – Mixed-Signal – RF Test
ATPG & Compression
Silicon Debug
Automotive Test & Safety
Built-In Self-Test (BIST)
Defect & Current Based Test
Defect & Fault Tolerance
Delay & Performance Test
Design for Testability – Yield or Reliability
Pre-silicon Design Verification & Validation
Post-silicon Validation
Hardware Security
Embedded System & Board Test
Embedded Test Methods
Emerging Technologies Test and Reliability
Fault Modeling and Simulation
Low-Power IC Test
Functional safety and test methods to ensure functional safety
Machine Learning in Test – Yield and Reliability
Microsystems/MEMS/Sensors Test
Memory Test and Repair
2.5D – 3D & SiP Test
Yield Optimization
On-Line Test & Error Correction
Power & Thermal Issues in Test
System-on-Chip (SOC) Test
Test & Reliability of Biomedical Devices
Test & Reliability of High-Speed I/O
Test & Reliability of Machine Learning Systems
Test Quality & Reliability
Test Standards & Economics
Test Resource Partitioning
Transient & Soft Errors
FPGA Test
2024年IEEE第42届VLSI测试研讨会(VTS 2024)
2024年4月22-24日
美国,亚利桑那州,坦佩
https://tttc-vts.org/public_html/new/2024/
该会议包括主题演讲、科学论文演示、简短的工业应用论文演示、特别会议和创新实践会议。
General Chairs:
Sule Ozev
Arizona State University
Email: [email protected]
Mehdi Tahoori
Karlsruhe Institute of Technology
Email: [email protected]
Program Chairs:
Naghmeh Karimi
University of Maryland, Baltimore County
Email: [email protected]
Jennifer Dworak
Southern Methodist University
Email: [email protected]
征稿主题:
Analog – Mixed-Signal – RF Test
ATPG & Compression
Silicon Debug
Automotive Test & Safety
Built-In Self-Test (BIST)
Defect & Current Based Test
Defect & Fault Tolerance
Delay & Performance Test
Design for Testability – Yield or Reliability
Pre-silicon Design Verification & Validation
Post-silicon Validation
Hardware Security
Embedded System & Board Test
Embedded Test Methods
Emerging Technologies Test and Reliability
Fault Modeling and Simulation
Low-Power IC Test
Functional safety and test methods to ensure functional safety
Machine Learning in Test – Yield and Reliability
Microsystems/MEMS/Sensors Test
Memory Test and Repair
2.5D – 3D & SiP Test
Yield Optimization
On-Line Test & Error Correction
Power & Thermal Issues in Test
System-on-Chip (SOC) Test
Test & Reliability of Biomedical Devices
Test & Reliability of High-Speed I/O
Test & Reliability of Machine Learning Systems
Test Quality & Reliability
Test Standards & Economics
Test Resource Partitioning
Transient & Soft Errors
FPGA Test

2026.05.22 - 2026.05.24 中国 南京

2026.05.29 - 2026.05.31 中国 成都

2026.11.11 - 2026.11.13 印度尼西亚 雅加达

2027.01.08 - 2027.01.10 日本 大阪

2026.06.12 - 2026.06.15
中国 杭州
投稿截止 2026.04.01

2026.06.05 - 2026.06.07
中国 青岛
投稿截止 2026.04.15

2026.06.12 - 2026.06.14
日本 京都
投稿截止 2026.03.30

2026.06.26 - 2026.06.28
中国 福州
投稿截止 2026.04.20